AR# 50991

描述

When choosing a flash device to incorporate with Zynq-7000 devices, it is important to consider the following logistical criteria:

• Is the device supported with the Xilinx tools?
• Will the device work with the Zynq device BootROM?
• Is the device supported with software like U-Boot and Linux?

此外还提供了一些设计考虑因素，包括：

• How many pins are required for a configuration method?
• How much flash memory is required?
• How fast can the Zynq-7000 device be configured?
• How difficult is it to manage the flash device?

Based on the logistical criteria, there are three categories of flash devices:

• - These devices meet the logistical criteria listed above.
  
  
  
• 
  
  
  
• - These devices have not been tested in any way by Xilinx with Zynq-7000 devices.
  
  
  
  
• 
  
  

Xilinx 只能为列表中标示为“Xilinx 已测试和支持”的器件提供技术支持。

解决方案

QSPI

Benefits of QSPI:

• High performance - QSPI is the fastest configuration solution.
• Low Pin count - QSPI has the lowest pin count of the configuration solution options besides SD.
• Easy management - QSPI can be accessed as linear memory in Zynq-7000 devices.此外，不需要坏模块管理。

Downsides of QSPI:

• Low memory density - QPSI is only supported up to 16 MB in single linear mode or 32 MB in dual linear mode because linear QSPI controllers only support 3-byte addressing.
  

供应商

Configuration and Specifications

Xilinx Supported Devices

* 2013.04 is the U-Boot release number (U-Boot from April, 2013), not the Xilinx tool release.

** Xilinx Tools indicate the ISE (iMPACT) version.

*** A patch to ISE14.7 and SDK 2013.3 may be required to program these flash devices in iMPACT and SDK.

The same patch works for both.

敬请参阅 (Xilinx 答复 59275)。

NAND

Benefits of NAND:

• High Memory density - NAND is an inexpensive solution for large density devices.

Downsides of NAND:

• Lower device performance - Maximum bandwidth is less than QSPI.
• High pin count - NAND devices require more pins than QSPI.
• Difficult Management - NAND devices are hard to manage.Bad blocks are a regular concern which require design decisions on how bad blocks will be managed for a particular system setup.

注：

Only On-Die ECC and 1-bit ECC NAND devices can be used with Zynq-7000 SoC.

• In order to use On-Die ECC with Zynq-7000 SoC, the flash MUST be a MICRON and MUST support bit 3 (Enable/Disable ECC) in Feature Address 90h.

仅选择 1 个芯片的 NAND 器件可以与 Zynq-7000 SoC 一起使用。

供应商

Micron on-die ECC NAND

Micron NAND devices typically require multi-bit ECC, which necessitates using only devices with on-die ECC support.请查看特定的数据手册，以了解有关片上 ECC 支持的信息。

Configuration and Specifications

Xilinx Supported Devices

* 2013.04 is the U-Boot release number (U-Boot from April, 2013), not the Xilinx tool release.

** Xilinx Tools indicate the ISE (iMPACT) version.

NOR

Benefits of NOR:

• Easy management - NOR can be accessed as linear memory in Zynq devices.In addition, bad blocks are not as much of a concern as, for example, NAND.

Downsides of NOR:

• High pin count - NOR requires nearly all of the 54 MIO pins.
• Low Density - NOR density is comparable to QSPI.

供应商

Configuration and Specifications

Xilinx Supported Devices

* 2013.04 is the U-Boot release number (U-Boot from April, 2013), not the Xilinx tool release.

** Xilinx Tools indicate the ISE (iMPACT) version.

The Zynq-7000 SoC is expected to work with eMMC devices because the protocol is the same as SD, but this has not been extensively verified.

Users must be careful to meet all timing requirements as they might or might not comply with eMMC.

Benefits of SD:

• High density - SD has densities comparable to NAND.
• Easy Management - Device is generally managed as a file system.Bad blocks do not need to be managed in the user design.

Downsides of SD:

• Slow performance - SD is slower than QSPI
• Mechanical considerations - SD cards require a connector.
  
  

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