March 8, 2022
The OFC exhibition opens today and includes a range of innovative AMD demonstrations focused on optical and Ethernet technology. As the largest global conference and exhibition for optical communications and networking professionals, OFC is the premier event in telecom and data center optics.
The demonstrations described below cover a range of key technology solutions for the telecom industry and include: security, switchable and high-density Ethernet, co-packaged optics, L1 acceleration and offload, and more.
This demo features the Network Security offering from AMD to protect data integrity and confidentiality at 400Gbps using MACSec (Layer 2) over Ethernet. The High Speed Crypto (HSC) engine used in this demonstration offers up to 400Gbps Encrypt/Decrypt functionality to secure High Speed Networks and Data Center Interconnect.
This demo features switchable 100G, 200G and 400G Ethernet. The 7nm Xilinx® Versal® FPGA demo is enabled utilizing the Integrated Multi-rate hardened Ethernet IP.
AMD is enabling next-generation data center networks with ultrahigh density 400G interfaces in a single chip. Xilinx Versal ACAPs have hardened Ethernet MAC, FEC, and PCS functions to allow for lower power and area solutions. This demo features switchable 100G, 200G, and 400G Ethernet interoperating with test equipment network in the Ethernet Alliance booth. The 7nm Xilinx® Versal® ACAP demo is enabled utilizing the Integrated hardened Ethernet IP.
Next-generation networks require even higher bandwidth. AMD is addressing that with high density multi-800G devices and showcasing interoperation of 800GE ETC with EXFO using Versal ACAP devices. The 7nm Xilinx® Versal® FPGA demo is enabled utilizing the Integrated hardened Ethernet IP.
AMD has partnered with Ranovus to demonstrate a new form factor of 800G optical interconnect. By integrating the optics into the package with Versal Premium ACAPs, AMD and Ranovus are able to drastically reduce power, simplify board routing, and reduce cost.
A Xilinx T1 Telco Accelerator card provides a vBBU offload solution with the low latency and power efficiency needed for virtualized 5G deployments. T1 cards offload L1 functionality in either a Lookaside or an Inline configuration, providing the flexibility to support a diverse set of 5G RU’s in a single, reconfigurable DU platform with low power and low TCO.
Freya is designed for 800G switch, transceiver and PHY design validation & Quality Assurance. It is based on Pulse Amplitude Modulation (PAM4), but it doubles the SerDes speed to 112Gbps and the Baud rate to 56GBaud. Freya supports Ethernet testing of 112Gbps SerDes PAM4 data rates of 100G / 200G / 400G / 800G. Winner of Frost & Sullivan's "New Product Innovation Award" for 2021
The Alveo™ SN1000 SmartNICs deliver protocol-level programmability at linerate performance, and are powered by a Xilinx 16nm UltraScale+™ architecture FPGA and an A72 Arm® processor subsystem with support for up to 16 cores.
In addition to these demonstrations featured at AMD’s OFC booth #5711 at the San Diego Convention Center, a technology showcase event entitled, “2.4Tb SmartPHY: Solutions for Next Generation 2.4Tb+ Line Systems” will take place on Wednesday March 9 from 10:15-10:45 PST in Theater III. Featuring Faisal Dada, director of communications marketing, Adaptable and Embedded Computing Group, AMD, and Gilles Garcia, senior director and communications business lead, Adaptable and Embedded Computing Group, AMD. Dada and Garcia will discuss industry-leading SmartPHY density using a single Xilinx Versal Premium ACAP to create line systems up to 2.4Tbps+ that also allow use of current and legacy interfaces and the ability to split clients over multiple wavelengths.
Visit www.ofcconference.org to view the entire schedule of events.